Polyimide flexible copper clad plate
Product specifications
Copper foil thickness specification (oz): 1/3, 1/2, 1
Glue thickness specification（ μ m) Adaptive: 10,14,20
PI specification (mil) PI film: 1/2, 1
Tg temperature (high Tg substrate) ≥ 90 º C
Product features
Very high peel strength
High folding and heat resistance
Excellent dimensional stability and chemical resistance
Excellent resistance to immersion welding
application area
General performance substrate (single/double-sided)
High Tg substrate (single/double-sided)
High Tg halogen-free substrate (single/double-sided)
